The following documents contain provisions which, through reference in this text, constitute provisions of the present document.
[1]
TR 21.905: "Vocabulary for 3GPP Specifications".
[2]
TR 38.848: "Study on Ambient IoT (Internet of Things) in RAN".
[3]
RP-240826: "Revised SID: Study on solutions for Ambient IoT (Internet of Things) in NR".
[4]
TR 38.869: "Study on low-power Wake-up Signal and Receiver for NR".
[5]
TS 38.212: "NR; Multiplexing and channel coding".
[6]
EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz - 960 MHz.
[7]
R1-2409358, "Discussion on ambient IoT device architectures", TCL, RAN1#119, Orlando, USA, November 2024.
[8]
R1-2409417, "Ultra low power device architectures for Ambient IoT", Huawei, HiSilicon, RAN1#119, Orlando, USA, November 2024.
[9]
R1-2409551, "Discussion on Ambient IoT device architectures", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[10]
R1-2409597, "Remaining issues for Ambient-IoT device architectures", Samsung, RAN1#119, Orlando, USA, November 2024.
[11]
R1-2409681, "Discussion on Ambient IoT Device architectures", vivo, RAN1#119, Orlando, USA, November 2024.
[12]
R1-2409941, "Study of the Ambient IoT devices architecture", CATT, RAN1#119, Orlando, USA, November 2024.
[13]
R1-2410091, "Discussion on device architecture for A-IoT device", OPPO, RAN1#119, Orlando, USA, November 2024.
[14]
R1-2410313, "Device architectures for Ambient IoT", InterDigital, Inc., RAN1#119, Orlando, USA, November 2024.
[15]
R1-2410389, "Study on device architectures for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[16]
R1-2410478, "Ambient IoT Device Architecture", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[17]
R1-2410514, "Ambient IoT device architectures", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[18]
R1-2407610, "Discussion on physical layer design for Rel-19 Ambient IoT devices", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[19]
R1-2407628, "Discussion on general aspects of physical layer design for Ambient IoT", TCL, RAN1#118bis, Hefei, China, October 2024.
[20]
R1-2407638, "General aspects of physical layer design for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[21]
R1-2407645, "General aspects of physical layer design for Ambient IoT", Nokia, RAN1#118bis, Hefei, China, October 2024.
[22]
R1-2407669, "On general aspects of physical layer design for Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[23]
R1-2407707, "Discussion on general aspects of physical layer design for Ambient IoT", Spreadtrum Communications, RAN1#118bis, Hefei, China, October 2024.
[24]
R1-2407734, "Discussion on general aspects of physical layer design for Ambient IoT", China Telecom, RAN1#118bis, Hefei, China, October 2024.
[25]
R1-2407862, "Discussion on General Aspects of Physical Layer Design", vivo, RAN1#118bis, Hefei, China, October 2024.
[26]
R1-2407906, "Discussion on general aspects of A-IoT physical layer design", CMCC, RAN1#118bis, Hefei, China, October 2024.
[27]
R1-2407970, "Discussion on physical layer design of Ambient IoT", Xiaomi, RAN1#118bis, Hefei, China, October 2024.
[28]
R1-2408048, "Discussion on general aspects of physical layer design", CATT, RAN1#118bis, Hefei, China, October 2024.
[29]
R1-2408147, "Discussion on general aspects of physical layer design of A-IoT communication", OPPO, RAN1#118bis, Hefei, China, October 2024.
[30]
R1-2408206, "Discussion on general aspects of ambient IoT physical layer design", NEC, RAN1#118bis, Hefei, China, October 2024.
[31]
R1-2408250, "Discussion on general aspects of physical layer design", Sharp, RAN1#118bis, Hefei, China, October 2024.
[32]
R1-2408272, "Discussion on Physical Layer Design for Ambient-IoT", EURECOM, RAN1#118bis, Hefei, China, October 2024.
[33]
R1-2408308, "On General Physical Layer Design Considerations for Ambient IoT Applications", Lekha Wireless Solutions, RAN1#118bis, Hefei, China, October 2024.
[34]
R1-2408410, "General aspects of Ambient IoT physical layer design", Sony, RAN1#118bis, Hefei, China, October 2024.
[35]
R1-2408466, "On remaining general physical layer design aspects for AIoT", Apple, RAN1#118bis, Hefei, China, October 2024.
[36]
R1-2408568, "Discussion on general aspects of physical layer design", ETRI, RAN1#118bis, Hefei, China, October 2024.
[37]
R1-2408599, "General aspects of physical layer design for Ambient IoT", Panasonic, RAN1#118bis, Hefei, China, October 2024.
[38]
R1-2408647, "Considerations for general aspects of Ambient IoT", Samsung, RAN1#118bis, Hefei, China, October 2024.
[39]
R1-2408672, "General aspects of Ambient IoT physical layer design", LG Electronics, RAN1#118bis, Hefei, China, October 2024.
[40]
R1-2408685, "Discussion on physical layer design for Ambient IoT", Comba, RAN1#118bis, Hefei, China, October 2024.
[41]
R1-2408701, "General aspects of physical layer design", MediaTek Inc., RAN1#118bis, Hefei, China, October 2024.
[42]
R1-2408730, "On the general aspects of physical layer design for Ambient IoT", InterDigital, Inc., RAN1#118bis, Hefei, China, October 2024.
[43]
R1-2408765, "Discussion on A-IoT physical layer design", ASUSTeK, RAN1#118bis, Hefei, China, October 2024.
[44]
R1-2408787, "Study on general aspects of physical layer design for Ambient IoT", NTT DOCOMO, INC., RAN1#118bis, Hefei, China, October 2024.
[45]
R1-2408851, "General aspects of physical layer design", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[46]
R1-2408875, "Discussion on multiple access for D2R", LG Uplus, RAN1#118bis, Hefei, China, October 2024.
[47]
R1-2408941, "Discussion on General aspects of physical layer design of AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#118bis, Hefei, China, October 2024.
[48]
R1-2408967, "Discussion on the physical layer design aspects for Ambient IoT devices", Lenovo, RAN1#118bis, Hefei, China, October 2024.
[49]
R1-2409005, "Discussion on general aspects of physical layer design for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[50]
R1-2406315, "Consideration on general aspects of physical layer", Fujitsu, RAN1#118, Maastricht, Netherlands, August 2024.
[51]
R1-2407119, "General aspects of physical layer design for Ambient IoT", ITL, RAN1#118, Maastricht, Netherlands, August 2024.
[52]
R1-2407088, "Discussion on General aspects of physical layer design", CEWiT, RAN1#118, Maastricht, Netherlands, August 2024.
[53]
R1-2402720, "Ambient IoT - General aspects of physical layer design, for uplink modulation", Wiliot, RAN1#116bis, Changsha, China, April 2024.
[54]
R1-2409359, "Discussion on general aspects of physical layer design for Ambient IoT", TCL, RAN1#119, Orlando, USA, November 2024.
[55]
R1-2409364, "General aspects of physical layer design for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[56]
R1-2409388, "General aspects of physical layer design for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[57]
R1-2409418, "On general aspects of physical layer design for Ambient IoT", Huawei, HiSilicon, RAN1#119, Orlando, USA, November 2024.
[58]
R1-2409513, "Discussion on general aspects of A-IoT physical layer design", CMCC, RAN1#119, Orlando, USA, November 2024.
[59]
R1-2409552, "Discussion on general aspects of physical layer design for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[60]
R1-2409598, "Considerations for general aspects of Ambient IoT", Samsung, RAN1#119, Orlando, USA, November 2024.
[61]
R1-2409637, "Discussion on general aspects of physical layer design for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[62]
R1-2409682, "Discussion on General Aspects of Physical Layer Design", vivo, RAN1#119, Orlando, USA, November 2024.
[63]
R1-2409897, "Discussion on physical layer design of Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[64]
R1-2409801, "On remaining general physical layer design aspects for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[65]
R1-2409942, "Discussion on general aspects of physical layer design", CATT, RAN1#119, Orlando, USA, November 2024.
[66]
R1-2410026, "On remaining open issues in Rel-19 Ambient IoT physical layer design", FUTUREWEI, RAN1#119, Orlando, USA, November 2024.
[67]
R1-2410059, "Discussions on FEC/repetition in R2D and D2R", Fujitsu, RAN1#119, Orlando, USA, November 2024.
[68]
R1-2410225, "Physical layer design of Ambient IoT", Sony, RAN1#119, Orlando, USA, November 2024.
[69]
R1-2410287, "General aspects of Ambient IoT physical layer design", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[70]
R1-2410311, "Discussion on physical layer design for Ambient IoT", InterDigital, Inc., RAN1#119, Orlando, USA, November 2024.
[71]
R1-2410352, "General aspects of physical layer design for Ambient IoT", Panasonic, RAN1#119, Orlando, USA, November 2024.
[72]
R1-2410479, "General aspects of physical layer design", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[73]
R1-2410515, "General aspects of physical layer design", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[74]
R1-2410591, "Discussion on General aspects of physical layer design of AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#119, Orlando, USA, November 2024.
[75]
J. K. Wolf and R. D. Blakeney, "An exact evaluation of the probability of undetected error for certain shortened binary CRC codes," Proc. Milcom '88, vol. 1, pp. 287-292, 1988.
[76]
R1-2407611, "Discussion on Frame Structure and Timing Aspects for Ambient IoT", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[77]
R1-2407639, "Frame structure and timing aspects for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[78]
R1-2407670, "On frame structure and timing aspects of Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[79]
R1-2407907, "Discussion on frame structure and timing aspects for A-IoT", CMCC, RAN1#118bis, Hefei, China, October 2024.
[80]
R1-2407971, "Discussion on frame structure and timing aspects for Ambient IoT", Xiaomi, RAN1#118bis, Hefei, China, October 2024.
[81]
R1-2408049, "Study of Frame structure and timing aspects for Ambient IoT", CATT, RAN1#118bis, Hefei, China, October 2024.
[82]
R1-2408068, "Discussion on frame structure and physical layer procedure for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[83]
R1-2408148, "Discussion on frame structure and timing aspects of A-IoT communication", OPPO, RAN1#118bis, Hefei, China, October 2024.
[84]
R1-2408234, "Discussion on frame structure and timing aspects for Ambient IoT", HONOR, RAN1#118bis, Hefei, China, October 2024.
[85]
R1-2408251, "Discussion on frame structure and timing aspects", Sharp, RAN1#118bis, Hefei, China, October 2024.
[86]
R1-2408411, "Frame structure and timing aspects for Ambient IoT", Sony, RAN1#118bis, Hefei, China, October 2024.
[87]
R1-2408434, "Frame structure and timing aspects of Ambient IoT", InterDigital, Inc., RAN1#118bis, Hefei, China, October 2024.
[88]
R1-2408467, "On remaining frame structure and timing aspects for AIoT", Apple, RAN1#118bis, Hefei, China, October 2024.
[89]
R1-2408536, "Discussion on A-IoT Frame Structure and Timing Aspects", Panasonic, RAN1#118bis, Hefei, China, October 2024.
[90]
R1-2408648, "Considerations for frame structure and timing aspects", Samsung, RAN1#118bis, Hefei, China, October 2024.
[91]
R1-2408742, "Considerations for frame structure and timing aspects", Semtech Neuchatel SA, RAN1#118bis, Hefei, China, October 2024.
[92]
R1-2408920, "Discussion on frame structure and timing aspects for Ambient IoT", TCL, RAN1#118bis, Hefei, China, October 2024.
[93]
R1-2408990, "Study on frame structure and timing aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#118bis, Hefei, China, October 2024.
[94]
R1-2409008, "Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT", vivo, RAN1#118bis, Hefei, China, October 2024.
[95]
R1-2409026, "Discussion on frame structure and physical layer procedures for Ambient IoT", Lenovo, RAN1#118bis, Hefei, China, October 2024.
[96]
R1-2409057, "Frame structure and timing aspects", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[97]
R1-2409365, "Frame structure and timing aspects for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[98]
R1-2409389, "Frame structure and timing aspects for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[99]
R1-2409419, "On frame structure and timing aspects of Ambient IoT", Huawei, HiSilicon, CBN, China Broadnet, RAN1#119, Orlando, USA, November 2024.
[100]
R1-2409485, "Discussion on frame structure and physical layer procedures for Ambient IoT", Lenovo, RAN1#119, Orlando, USA, November 2024.
[101]
R1-2409514, "Discussion on frame structure and timing aspects for A-IoT", CMCC, RAN1#119, Orlando, USA, November 2024.
[102]
R1-2409553, "Discussion on frame structure and physical layer procedure for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[103]
R1-2409599, "Considerations for frame structure and timing aspects", Samsung, RAN1#119, Orlando, USA, November 2024.
[104]
R1-2409638, "Discussion on frame structure and timing aspects for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[105]
R1-2409683, "Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT", vivo, RAN1#119, Orlando, USA, November 2024.
[106]
R1-2409802, "On remaining frame structure and timing aspects for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[107]
R1-2409865, "Discussion on frame structure and timing for ambient IoT", NEC, RAN1#119, Orlando, USA, November 2024.
[108]
R1-2409898, "Discussion on frame structure and timing aspects for Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[109]
R1-2409943, "Study of Frame structure and timing aspects for Ambient IoT", CATT, RAN1#119, Orlando, USA, November 2024.
[110]
R1-2410063, "Discussion on A-IoT Frame Structure and Timing Aspects", Panasonic, RAN1#119, Orlando, USA, November 2024.
[111]
R1-2410093, "Discussion on frame structure and timing aspects of A-IoT communication", OPPO, RAN1#119, Orlando, USA, November 2024.
[112]
R1-2410288, "Frame structure and timing aspects for Ambient IoT", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[113]
R1-2410391, "Study on frame structure and timing aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[114]
R1-2410480, "Frame structure and timing aspects", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[115]
R1-2410516, "Frame structure and timing aspects", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[116]
R1-2410578, "Discussion on Frame structure and timing aspects", CEWiT, RAN1#119, Orlando, USA, November 2024.
[117]
R1-2410647, "Discussion on frame structure and timing aspects for Ambient IoT", China Telecom, RAN1#119, Orlando, USA, November 2024.
[118]
R1-2407612, "Discussion on D2R and R2D Channel/Signal Aspects for Ambient IoT", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[119]
R1-2407671, "Physical channels and signals for Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[120]
R1-2407864, "Discussion on Downlink and uplink channel/signal aspects", vivo, RAN1#118bis, Hefei, China, October 2024.
[121]
R1-2408050, "DL and UL Physical Channels/signals design in support of Ambient IoT devices", CATT, RAN1#118bis, Hefei, China, October 2024.
[122]
R1-2408069, "Discussion on channel and signal for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[123]
R1-2408149, "Discussion on downlink and uplink channel/signal aspects for A-IoT", OPPO, RAN1#118bis, Hefei, China, October 2024.
[124]
R1-2408532, "Considerations on Intermediate UE in A-IoT", Continental Automotive, RAN1#118bis, Hefei, China, October 2024.
[125]
R1-2408703, "Downlink and uplink channel/signal aspects", MediaTek Inc., RAN1#118bis, Hefei, China, October 2024.
[126]
R1-2408853, "Downlink and uplink channel/signal aspects", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[127]
R1-2408932, "Discussion on Downlink and Uplink channel/signal aspects", CEWiT, RAN1#118bis, Hefei, China, October 2024.
[128]
R1-2408943, "Discussion on Downlink and Uplink channel signal aspects for AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#118bis, Hefei, China, October 2024.
[129]
R1-2409023, "Downlink and uplink channel/signal aspects for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[130]
R1-2409360, "Discussion on downlink and uplink channel/signal aspects for Ambient IoT", TCL, RAN1#119, Orlando, USA, November 2024.
[131]
R1-2409366, "R2D and D2R channel/signal aspects for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[132]
R1-2409420, "Physical channels and signals for Ambient IoT", Huawei, HiSilicon, CBN, China Broadnet, RAN1#119, Orlando, USA, November 2024.
[133]
R1-2409515, "Discussion on downlink and uplink channel/signal aspects", CMCC, RAN1#119, Orlando, USA, November 2024.
[134]
R1-2409554, "Discussion on channel and signal for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[135]
R1-2409600, "Considerations for downlink and uplink channel/signal aspect", Samsung, RAN1#119, Orlando, USA, November 2024.
[136]
R1-2409639, "Discussion on downlink and uplink channel/signal aspects for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[137]
R1-2409684, "Discussion on Downlink and uplink channel/signal aspects", vivo, RAN1#119, Orlando, USA, November 2024.
[138]
R1-2409803, "On remaining details of physical channels/signals for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[139]
R1-2409899, "Discussion on downlink and uplink channel and signal aspects for Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[140]
R1-2409944, "DL and UL Physical Channels/signals design in support of Ambient IoT devices", CATT, RAN1#119, Orlando, USA, November 2024.
[141]
R1-2410028, "D2R and R2D Channel/Signal Aspects for Ambient IoT", FUTUREWEI, RAN1#119, Orlando, USA, November 2024.
[142]
R1-2410061, "Discussion on downlink and uplink channel/signal aspects", Fujitsu, RAN1#119, Orlando, USA, November 2024.
[143]
R1-2410094, "Discussion on downlink and uplink channel/signal aspects for A-IoT", OPPO, RAN1#119, Orlando, USA, November 2024.
[144]
R1-2410127, "Downlink and uplink channel/signal aspects for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[145]
R1-2410269, "Discussion on downlink and uplink channel/signal aspects for A-IoT", ETRI, RAN1#119, Orlando, USA, November 2024.
[146]
R1-2410289, "Downlink and uplink channel/signal aspects for Ambient IoT", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[147]
R1-2410392, "Study on downlink and uplink channel/signal aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[148]
R1-2410481, "Downlink and uplink channel/signal aspects", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[149]
R1-2410517, "Downlink and uplink channel/signal aspects", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[150]
R1-2410579, "Discussion on Downlink and Uplink channel/signal aspects", CEWiT, RAN1#119, Orlando, USA, November 2024.
[151]
TR 23.700-13: "Study on Architecture support of Ambient power-enabled Internet of Things".
→ to date,
still a draft
[152]
TR 33.713: "Study on security aspects of Ambient Internet of Things (AIoT) services in 5G".
→ to date,
still a draft
[153]
TS 38.300: "NR and NG-RAN Overall description; Stage-2".
[154]
TS 22.369: "Service requirements for Ambient power-enabled IoT".
[155]
R4-2417981, " Collection of simulation results for Ambient-IoT co-existence study ", Huawei, HiSilicon, RAN4#113, Orlando, USA, November 2024.
[156]
K. Fors, E. Axell, S. Linder and P. Stenumgaard, "On the Impact of CW interference on 5G NR," 2019 International Symposium on Electromagnetic Compatibility - EMC EUROPE, Barcelona, Spain, 2019, pp. 1049-1054.
[157]
R4-2418182, "Further evaluation on D2T2 co-existence", vivo, RAN4#113, Orlando, USA, November 2024.
[158]
R4-2418852, "Discussion on Ambient IoT Coexistence Evaluations", Qualcomm Incorporated, RAN4#113, Orlando, USA, November 2024.
[159]
[160]
R1-2405855, "On external carrier wave for backscattering based Ambient IoT device", Huawei, HiSilicon, RAN1#118. Maastricht, Netherlands, August 2024.
[161]
R1-2408854, "Waveform characteristics of carrier-wave provided externally to the Ambient IoT device", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[162]
R1-2408851, "General aspects of physical layer design", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[163]
R1-2407608, "Discussion on evaluation assumptions and results for Ambient IoT devices", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[164]
R1-2407636, "Evaluation assumptions and results for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[165]
R1-2407643, "Evaluation assumptions and results for Ambient IoT", Nokia, RAN1#118bis, Hefei, China, October 2024.
[166]
R1-2407667, "Evaluation methodology and assumptions for Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[167]
R1-2407705, "Discussion on evaluation assumptions and results for Ambient IoT", Spreadtrum Communications, RAN1#118bis, Hefei, China, October 2024.
[168]
R1-2407760, "Discussion on Link Level simulation of A-IoT", Tejas Network Limited, RAN1#118bis, Hefei, China, October 2024.
[169]
R1-2407860, "Evaluation methodologies assumptions and results for Ambient IoT", vivo, RAN1#118bis, Hefei, China, October 2024.
[170]
R1-2407968, "Evaluation assumptions and results for Ambient IoT", Xiaomi, RAN1#118bis, Hefei, China, October 2024.
[171]
R1-2408046, "The evaluation methodology and preliminary results of Ambient IoT", CATT, RAN1#118bis, Hefei, China, October 2024.
[172]
R1-2408065, "Discussion on Ambient IoT evaluations", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[173]
R1-2408145, "Discussion on evaluation assumptions and results for A-IoT", OPPO, RAN1#118bis, Hefei, China, October 2024.
[174]
R1-2408233, "Discussion on evaluation assumptions and results for Ambient IoT", HONOR, RAN1#118bis, Hefei, China, October 2024.
[175]
R1-2408355, "Analysis for Inventory Completion Time for Multiple A-IoT Devices", Wiliot Ltd., RAN1#118bis, Hefei, China, October 2024.
[176]
R1-2408464, "On remaining evaluation assumptions and results for AIoT", Apple, RAN1#118bis, Hefei, China, October 2024.
[177]
R1-2408670, "Discussion on Ambient IoT evaluation", LG Electronics, RAN1#118bis, Hefei, China, October 2024.
[178]
R1-2408699, "Evaluation assumptions and results for A-IoT", MediaTek Inc., RAN1#118bis, Hefei, China, October 2024.
[179]
R1-2408731, "Evaluation results for Ambient IoT", InterDigital, Inc., RAN1#118bis, Hefei, China, October 2024.
[180]
R1-2408785, "Study on evaluation assumptions and results for Ambient IoT", NTT DOCOMO, INC., RAN1#118bis, Hefei, China, October 2024.
[181]
R1-2408849, "Evaluation Assumptions and Results", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[182]
R1-2408930, "Discussion on Evaluation assumptions and results", CEWiT, RAN1#118bis, Hefei, China, October 2024.
[183]
R1-2408938, "Evaluation assumption and results for AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#118bis, Hefei, China, October 2024.
[184]
R1-2408966, "Discussion on the evaluation assumptions for Ambient IoT devices", Lenovo, RAN1#118bis, Hefei, China, October 2024.
[185]
R1-2408987, "Ambient IoT evaluations", Sony, RAN1#118bis, Hefei, China, October 2024.
[186]
R1-2409006, "Discussion on evaluation assumptions and results for Ambient IoT", CMCC, RAN1#118bis, Hefei, China, October 2024.
[187]
R1-2409022, "Discussion on evaluation assumptions and results for Ambient IoT", China Telecom, RAN1#118bis, Hefei, China, October 2024.
[188]
R1-2409027, "Considerations for evaluation assumptions and results", Samsung, RAN1#118bis, Hefei, China, October 2024.
[189]
R1-2410875, "TP for coverage results spreadsheet for TR38.769", Moderator (CMCC), RAN1#119, Orlando, USA, November 2024.
[190]
R1-2409362, "Evaluation assumptions and results for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[191]
R1-2409390, "Evaluation assumptions and results for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[192]
R1-2409416, "Evaluation methodology and assumptions for Ambient IoT", Huawei, HiSilicon, RAN1#119, Orlando, USA, November 2024.
[193]
R1-2409511, "Discussion on evaluation assumptions and results for Ambient IoT", CMCC, RAN1#119, Orlando, USA, November 2024.
[194]
R1-2409635, "Discussion on evaluation assumptions and results for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[195]
R1-2409680, "Evaluation methodologies assumptions and results for Ambient IoT", vivo, RAN1#119, Orlando, USA, November 2024.
[196]
R1-2409757, "Discussion on Link Level simulation of A-IoT", Tejas Networks Limited, RAN1#119, Orlando, USA, November 2024.
[197]
R1-2409799, "On remaining evaluation assumptions and results for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[198]
R1-2409895, "Evaluation assumptions and results for Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[199]
R1-2409940, "The evaluation methodology and preliminary results of Ambient IoT", CATT, RAN1#119, Orlando, USA, November 2024.
[200]
R1-2410000, "Discussion on evaluation assumptions and results for Ambient IoT", China Telecom, RAN1#119, Orlando, USA, November 2024.
[201]
R1-2410024, "Discussion on evaluation assumptions and results for Ambient IoT devices", FUTUREWEI, RAN1#119, Orlando, USA, November 2024.
[202]
R1-2410090, "Discussion on evaluation assumptions and results for A-IoT", OPPO, RAN1#119, Orlando, USA, November 2024.
[203]
R1-2410178, "Discussion on evaluation assumptions and results for Ambient IoT", HONOR, RAN1#119, Orlando, USA, November 2024.
[204]
R1-2410285, "Discussion on Ambient IoT evaluation", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[205]
R1-2410312, "Evaluation results for Ambient IoT", InterDigital, Inc., RAN1#119, Orlando, USA, November 2024.
[206]
R1-2410351, "Link level simulation for Ambient IoT R2D", Panasonic, RAN1#119, Orlando, USA, November 2024.
[207]
R1-2410388, "Study on evaluation assumptions and results for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[208]
R1-2410422, "Discussion on evaluation assumptions and results for Ambient IoT", Indian Institute of Tech (M), RAN1#119, Orlando, USA, November 2024.
[209]
R1-2410477, "Evaluation Assumptions and Results", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[210]
R1-2410513, "Evaluation assumptions and results for A-IoT", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[211]
R1-2410551, "Discussion on the evaluation assumptions for Ambient IoT devices", Lenovo, RAN1#119, Orlando, USA, November 2024.
[212]
R1-2410590, "Evaluation assumption and results for AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#119, Orlando, USA, November 2024.
[213]
R1-2410629, "Discussion on Ambient IoT evaluations", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[214]
R1-2410630, "Considerations for evaluation assumptions and results", Samsung, RAN1#119, Orlando, USA, November 2024.
[215]
R1-2410658, "Discussion on Evaluation assumptions and results", CEWiT, RAN1#119, Orlando, USA, November 2024.
[216]
N. E. Roberts et al., "26.8 A 236nW −56.5dBm-sensitivity bluetooth low-energy wakeup receiver with energy harvesting in 65nm CMOS," 2016 IEEE International Solid-State Circuits Conference (ISSCC), San Francisco, CA, USA, 2016, pp. 450-451.
[217]
A. Klinefelter et al., "21.3 A 6.45μW self-powered IoT SoC with integrated energy-harvesting power management and ULP asymmetric radios," 2015 IEEE International Solid-State Circuits Conference - (ISSCC) Digest of Technical Papers, San Francisco, CA, USA, 2015, pp. 1-3.
[218]
S. Oh, N. E. Roberts and D. D. Wentzloff, "A 116nW multi-band wake-up receiver with 31-bit correlator and interference rejection," Proceedings of the IEEE 2013 Custom Integrated Circuits Conference, San Jose, CA, USA, 2013, pp. 1-4.
[219]
"A Design-for-Sensitivity Strategy for Charge-Pump-Based Receivers", Austrochip Workshop on Microelectronics (Austrochip), Oct. 2020
[220]
"A 2.4 GHz ISM Band OOK Transceiver With High Energy Efficiency for Biomedical Implantable Applications", IEEE Transactions on Biomedical Circuits and Systems (Vol. 14, Iss. 1), Feb. 2020
[221]
"A 65 μW, 1.9 GHz RF to digital baseband wakeup receiver for wireless sensor nodes", IEEE Custom Integrated Circuits Conference, Sep. 2007
[222]
S. Y. Lee et al., "A programmable wireless EEG monitoring SoC with open/closed-Loop optogenetic and electrical stimulation for epilepsy control," in Proc. IEEE Int. Solid-State Circuits Conf. (ISSCC) Dig. Tech. Papers, Feb. 2019, pp. 372-374.
[223]
N. M. Pletcher, S. Gambini, and J. Rabaey, "A 52 μW wake-up receiver with -72 dBm sensitivity using an uncertain-IF architecture," IEEE J. Solid-State Circuits, vol. 44, no. 1, pp. 269-280, Jan. 2009.
[224]
Alpman, Erkan, et al. "802.11 g/n compliant fully integrated wake-up receiver with -72 dBm sensitivity in 14-nm FinFET CMOS." IEEE Journal of Solid-State Circuits 53.5 (2018).
[225]
R. Liu et al., "An 802.11ba-based wake-up radio receiver with Wi-Fi transceiver integration", IEEE J. Solid-State Circuits, vol. 55, no. 5, pp. 1151-1164, May 2020.
[226]
R4-1706112, "[DRAFT]Reply LS regarding 1024QAM", RAN4, RAN4#83, Hangzhou, China, May 2017.