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Content for  TR 38.769  Word version:  19.0.0

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0  Introductionp. 8

In recent years, IoT has attracted much attention in the wireless communication world. More 'things' are expected to be interconnected for improving productivity efficiency and increasing comforts of life. Further reduction of size, complexity, and power consumption of IoT devices can enable the deployment of tens or even hundreds of billions of IoT devices for various applications and provide added value across the entire value chain. It is impossible to power all the IoT devices by battery that needs to be replaced or recharged manually, which leads to high maintenance cost, serious environmental issues, and even safety hazards for some use cases, for example, wireless sensors in electrical power, and petroleum industries.
Most of the existing wireless communication devices are powered by batteries that need to be replaced or recharged manually. The automation and digitization of various industries opens numerous new markets requiring new IoT technologies of supporting batteryless devices with no energy storage capability or devices with energy storage that do not need to be replaced or recharged manually.
An example type of application is asset identification, which presently has to resort mainly to barcodes and RFID in most industries. The main advantage of these two technologies is the ultra-low complexity and small form factor of the tags. However, the limited reading range of a few meters usually requires handheld scanning which leads to labor intensive and time-consuming operations, or RFID portals/gates which leads to costly deployments. Moreover, the lack of interference management scheme results in severe interference between RFID readers and capacity problems, especially in case of dense deployment. It is hard to support a large-scale network with seamless coverage for RFID.
In contrast, this study investigates solutions for Ambient IoT, a new IoT technology to open new markets within 3GPP systems, whose number of connections and/or device density can be orders of magnitude higher than existing 3GPP IoT technologies, and which can provide complexity and power consumption orders-of-magnitude lower than existing 3GPP LPWA technologies such as NB-IoT and LTE-MTC. TSG RAN has completed a Rel-18 RAN-level SI on Ambient IoT, producing TR 38.848 which provides a terminological and scoping framework for future discussions of Ambient IoT. This has defined representative use cases, deployment scenarios, connectivity topologies, Ambient IoT devices, design targets, and required functionalities; it also conducted a preliminary feasibility assessment.
The SI reported in this present TR is now to investigate solutions in detail at RAN-WG level for Ambient IoT in 3GPP.
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1  Scopep. 9

The overall objective of the SI is to study a harmonized air interface design with minimized differences (where necessary) for Ambient IoT to enable the following devices:
  • ~1 μW peak power consumption, has energy storage, initial sampling frequency offset (SFO) up to 10X ppm, neither R2D nor D2R amplification in the device. The device's D2R transmission is backscattered on a carrier wave provided externally.
  • ≤ a few hundred μW peak power consumption has energy storage, initial sampling frequency offset (SFO) up to 10X ppm, both R2D and/or D2R amplification in the device. The device's D2R transmission may be generated internally by the device, or be backscattered on a carrier wave provided externally.
Referring to the definitions in TR 38.848, this is done in the context of:
  • Deployment scenario 1 (indoor-to-indoor) with Topology 1, and indoor microcell basestation.
  • Deployment scenario 2 (indoor-to-outdoor) with Topology 2 and indoor UE as intermediate node under network control, and outdoor macrocell basestation.
The spectrum considered is FR1 licensed spectrum in FDD, which can be in-band to NR, in guard-band to NR/LTE, or in standalone band(s). The traffic types considered are DO-DTT and DT, focusing on indoor inventory and indoor command representative use cases. The study also assesses whether the harmonized air interface can address the DO-A use case.
Study of the design of energy harvesting signal/waveform is out of scope in Rel-19.
Up

2  Referencesp. 9

The following documents contain provisions which, through reference in this text, constitute provisions of the present document.
  • References are either specific (identified by date of publication, edition number, version number, etc.) or non-specific.
  • For a specific reference, subsequent revisions do not apply.
  • For a non-specific reference, the latest version applies. In the case of a reference to a 3GPP document (including a GSM document), a non-specific reference implicitly refers to the latest version of that document in the same Release as the present document.
[1]
TR 21.905: "Vocabulary for 3GPP Specifications".
[2]
TR 38.848: "Study on Ambient IoT (Internet of Things) in RAN".
[3]
RP-240826: "Revised SID: Study on solutions for Ambient IoT (Internet of Things) in NR".
[4]
TR 38.869: "Study on low-power Wake-up Signal and Receiver for NR".
[5]
TS 38.212: "NR; Multiplexing and channel coding".
[6]
EPC Radio-Frequency Identity Protocols Class-1 Generation-2 UHF RFID Protocol for Communications at 860 MHz - 960 MHz.
[7]
R1-2409358, "Discussion on ambient IoT device architectures", TCL, RAN1#119, Orlando, USA, November 2024.
[8]
R1-2409417, "Ultra low power device architectures for Ambient IoT", Huawei, HiSilicon, RAN1#119, Orlando, USA, November 2024.
[9]
R1-2409551, "Discussion on Ambient IoT device architectures", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[10]
R1-2409597, "Remaining issues for Ambient-IoT device architectures", Samsung, RAN1#119, Orlando, USA, November 2024.
[11]
R1-2409681, "Discussion on Ambient IoT Device architectures", vivo, RAN1#119, Orlando, USA, November 2024.
[12]
R1-2409941, "Study of the Ambient IoT devices architecture", CATT, RAN1#119, Orlando, USA, November 2024.
[13]
R1-2410091, "Discussion on device architecture for A-IoT device", OPPO, RAN1#119, Orlando, USA, November 2024.
[14]
R1-2410313, "Device architectures for Ambient IoT", InterDigital, Inc., RAN1#119, Orlando, USA, November 2024.
[15]
R1-2410389, "Study on device architectures for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[16]
R1-2410478, "Ambient IoT Device Architecture", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[17]
R1-2410514, "Ambient IoT device architectures", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[18]
R1-2407610, "Discussion on physical layer design for Rel-19 Ambient IoT devices", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[19]
R1-2407628, "Discussion on general aspects of physical layer design for Ambient IoT", TCL, RAN1#118bis, Hefei, China, October 2024.
[20]
R1-2407638, "General aspects of physical layer design for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[21]
R1-2407645, "General aspects of physical layer design for Ambient IoT", Nokia, RAN1#118bis, Hefei, China, October 2024.
[22]
R1-2407669, "On general aspects of physical layer design for Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[23]
R1-2407707, "Discussion on general aspects of physical layer design for Ambient IoT", Spreadtrum Communications, RAN1#118bis, Hefei, China, October 2024.
[24]
R1-2407734, "Discussion on general aspects of physical layer design for Ambient IoT", China Telecom, RAN1#118bis, Hefei, China, October 2024.
[25]
R1-2407862, "Discussion on General Aspects of Physical Layer Design", vivo, RAN1#118bis, Hefei, China, October 2024.
[26]
R1-2407906, "Discussion on general aspects of A-IoT physical layer design", CMCC, RAN1#118bis, Hefei, China, October 2024.
[27]
R1-2407970, "Discussion on physical layer design of Ambient IoT", Xiaomi, RAN1#118bis, Hefei, China, October 2024.
[28]
R1-2408048, "Discussion on general aspects of physical layer design", CATT, RAN1#118bis, Hefei, China, October 2024.
[29]
R1-2408147, "Discussion on general aspects of physical layer design of A-IoT communication", OPPO, RAN1#118bis, Hefei, China, October 2024.
[30]
R1-2408206, "Discussion on general aspects of ambient IoT physical layer design", NEC, RAN1#118bis, Hefei, China, October 2024.
[31]
R1-2408250, "Discussion on general aspects of physical layer design", Sharp, RAN1#118bis, Hefei, China, October 2024.
[32]
R1-2408272, "Discussion on Physical Layer Design for Ambient-IoT", EURECOM, RAN1#118bis, Hefei, China, October 2024.
[33]
R1-2408308, "On General Physical Layer Design Considerations for Ambient IoT Applications", Lekha Wireless Solutions, RAN1#118bis, Hefei, China, October 2024.
[34]
R1-2408410, "General aspects of Ambient IoT physical layer design", Sony, RAN1#118bis, Hefei, China, October 2024.
[35]
R1-2408466, "On remaining general physical layer design aspects for AIoT", Apple, RAN1#118bis, Hefei, China, October 2024.
[36]
R1-2408568, "Discussion on general aspects of physical layer design", ETRI, RAN1#118bis, Hefei, China, October 2024.
[37]
R1-2408599, "General aspects of physical layer design for Ambient IoT", Panasonic, RAN1#118bis, Hefei, China, October 2024.
[38]
R1-2408647, "Considerations for general aspects of Ambient IoT", Samsung, RAN1#118bis, Hefei, China, October 2024.
[39]
R1-2408672, "General aspects of Ambient IoT physical layer design", LG Electronics, RAN1#118bis, Hefei, China, October 2024.
[40]
R1-2408685, "Discussion on physical layer design for Ambient IoT", Comba, RAN1#118bis, Hefei, China, October 2024.
[41]
R1-2408701, "General aspects of physical layer design", MediaTek Inc., RAN1#118bis, Hefei, China, October 2024.
[42]
R1-2408730, "On the general aspects of physical layer design for Ambient IoT", InterDigital, Inc., RAN1#118bis, Hefei, China, October 2024.
[43]
R1-2408765, "Discussion on A-IoT physical layer design", ASUSTeK, RAN1#118bis, Hefei, China, October 2024.
[44]
R1-2408787, "Study on general aspects of physical layer design for Ambient IoT", NTT DOCOMO, INC., RAN1#118bis, Hefei, China, October 2024.
[45]
R1-2408851, "General aspects of physical layer design", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[46]
R1-2408875, "Discussion on multiple access for D2R", LG Uplus, RAN1#118bis, Hefei, China, October 2024.
[47]
R1-2408941, "Discussion on General aspects of physical layer design of AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#118bis, Hefei, China, October 2024.
[48]
R1-2408967, "Discussion on the physical layer design aspects for Ambient IoT devices", Lenovo, RAN1#118bis, Hefei, China, October 2024.
[49]
R1-2409005, "Discussion on general aspects of physical layer design for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[50]
R1-2406315, "Consideration on general aspects of physical layer", Fujitsu, RAN1#118, Maastricht, Netherlands, August 2024.
[51]
R1-2407119, "General aspects of physical layer design for Ambient IoT", ITL, RAN1#118, Maastricht, Netherlands, August 2024.
[52]
R1-2407088, "Discussion on General aspects of physical layer design", CEWiT, RAN1#118, Maastricht, Netherlands, August 2024.
[53]
R1-2402720, "Ambient IoT - General aspects of physical layer design, for uplink modulation", Wiliot, RAN1#116bis, Changsha, China, April 2024.
[54]
R1-2409359, "Discussion on general aspects of physical layer design for Ambient IoT", TCL, RAN1#119, Orlando, USA, November 2024.
[55]
R1-2409364, "General aspects of physical layer design for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[56]
R1-2409388, "General aspects of physical layer design for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[57]
R1-2409418, "On general aspects of physical layer design for Ambient IoT", Huawei, HiSilicon, RAN1#119, Orlando, USA, November 2024.
[58]
R1-2409513, "Discussion on general aspects of A-IoT physical layer design", CMCC, RAN1#119, Orlando, USA, November 2024.
[59]
R1-2409552, "Discussion on general aspects of physical layer design for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[60]
R1-2409598, "Considerations for general aspects of Ambient IoT", Samsung, RAN1#119, Orlando, USA, November 2024.
[61]
R1-2409637, "Discussion on general aspects of physical layer design for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[62]
R1-2409682, "Discussion on General Aspects of Physical Layer Design", vivo, RAN1#119, Orlando, USA, November 2024.
[63]
R1-2409897, "Discussion on physical layer design of Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[64]
R1-2409801, "On remaining general physical layer design aspects for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[65]
R1-2409942, "Discussion on general aspects of physical layer design", CATT, RAN1#119, Orlando, USA, November 2024.
[66]
R1-2410026, "On remaining open issues in Rel-19 Ambient IoT physical layer design", FUTUREWEI, RAN1#119, Orlando, USA, November 2024.
[67]
R1-2410059, "Discussions on FEC/repetition in R2D and D2R", Fujitsu, RAN1#119, Orlando, USA, November 2024.
[68]
R1-2410225, "Physical layer design of Ambient IoT", Sony, RAN1#119, Orlando, USA, November 2024.
[69]
R1-2410287, "General aspects of Ambient IoT physical layer design", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[70]
R1-2410311, "Discussion on physical layer design for Ambient IoT", InterDigital, Inc., RAN1#119, Orlando, USA, November 2024.
[71]
R1-2410352, "General aspects of physical layer design for Ambient IoT", Panasonic, RAN1#119, Orlando, USA, November 2024.
[72]
R1-2410479, "General aspects of physical layer design", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[73]
R1-2410515, "General aspects of physical layer design", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[74]
R1-2410591, "Discussion on General aspects of physical layer design of AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#119, Orlando, USA, November 2024.
[75]
J. K. Wolf and R. D. Blakeney, "An exact evaluation of the probability of undetected error for certain shortened binary CRC codes," Proc. Milcom '88, vol. 1, pp. 287-292, 1988.
[76]
R1-2407611, "Discussion on Frame Structure and Timing Aspects for Ambient IoT", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[77]
R1-2407639, "Frame structure and timing aspects for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[78]
R1-2407670, "On frame structure and timing aspects of Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[79]
R1-2407907, "Discussion on frame structure and timing aspects for A-IoT", CMCC, RAN1#118bis, Hefei, China, October 2024.
[80]
R1-2407971, "Discussion on frame structure and timing aspects for Ambient IoT", Xiaomi, RAN1#118bis, Hefei, China, October 2024.
[81]
R1-2408049, "Study of Frame structure and timing aspects for Ambient IoT", CATT, RAN1#118bis, Hefei, China, October 2024.
[82]
R1-2408068, "Discussion on frame structure and physical layer procedure for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[83]
R1-2408148, "Discussion on frame structure and timing aspects of A-IoT communication", OPPO, RAN1#118bis, Hefei, China, October 2024.
[84]
R1-2408234, "Discussion on frame structure and timing aspects for Ambient IoT", HONOR, RAN1#118bis, Hefei, China, October 2024.
[85]
R1-2408251, "Discussion on frame structure and timing aspects", Sharp, RAN1#118bis, Hefei, China, October 2024.
[86]
R1-2408411, "Frame structure and timing aspects for Ambient IoT", Sony, RAN1#118bis, Hefei, China, October 2024.
[87]
R1-2408434, "Frame structure and timing aspects of Ambient IoT", InterDigital, Inc., RAN1#118bis, Hefei, China, October 2024.
[88]
R1-2408467, "On remaining frame structure and timing aspects for AIoT", Apple, RAN1#118bis, Hefei, China, October 2024.
[89]
R1-2408536, "Discussion on A-IoT Frame Structure and Timing Aspects", Panasonic, RAN1#118bis, Hefei, China, October 2024.
[90]
R1-2408648, "Considerations for frame structure and timing aspects", Samsung, RAN1#118bis, Hefei, China, October 2024.
[91]
R1-2408742, "Considerations for frame structure and timing aspects", Semtech Neuchatel SA, RAN1#118bis, Hefei, China, October 2024.
[92]
R1-2408920, "Discussion on frame structure and timing aspects for Ambient IoT", TCL, RAN1#118bis, Hefei, China, October 2024.
[93]
R1-2408990, "Study on frame structure and timing aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#118bis, Hefei, China, October 2024.
[94]
R1-2409008, "Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT", vivo, RAN1#118bis, Hefei, China, October 2024.
[95]
R1-2409026, "Discussion on frame structure and physical layer procedures for Ambient IoT", Lenovo, RAN1#118bis, Hefei, China, October 2024.
[96]
R1-2409057, "Frame structure and timing aspects", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[97]
R1-2409365, "Frame structure and timing aspects for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[98]
R1-2409389, "Frame structure and timing aspects for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[99]
R1-2409419, "On frame structure and timing aspects of Ambient IoT", Huawei, HiSilicon, CBN, China Broadnet, RAN1#119, Orlando, USA, November 2024.
[100]
R1-2409485, "Discussion on frame structure and physical layer procedures for Ambient IoT", Lenovo, RAN1#119, Orlando, USA, November 2024.
[101]
R1-2409514, "Discussion on frame structure and timing aspects for A-IoT", CMCC, RAN1#119, Orlando, USA, November 2024.
[102]
R1-2409553, "Discussion on frame structure and physical layer procedure for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[103]
R1-2409599, "Considerations for frame structure and timing aspects", Samsung, RAN1#119, Orlando, USA, November 2024.
[104]
R1-2409638, "Discussion on frame structure and timing aspects for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[105]
R1-2409683, "Discussion on Frame structure, random access, scheduling and timing aspects for Ambient IoT", vivo, RAN1#119, Orlando, USA, November 2024.
[106]
R1-2409802, "On remaining frame structure and timing aspects for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[107]
R1-2409865, "Discussion on frame structure and timing for ambient IoT", NEC, RAN1#119, Orlando, USA, November 2024.
[108]
R1-2409898, "Discussion on frame structure and timing aspects for Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[109]
R1-2409943, "Study of Frame structure and timing aspects for Ambient IoT", CATT, RAN1#119, Orlando, USA, November 2024.
[110]
R1-2410063, "Discussion on A-IoT Frame Structure and Timing Aspects", Panasonic, RAN1#119, Orlando, USA, November 2024.
[111]
R1-2410093, "Discussion on frame structure and timing aspects of A-IoT communication", OPPO, RAN1#119, Orlando, USA, November 2024.
[112]
R1-2410288, "Frame structure and timing aspects for Ambient IoT", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[113]
R1-2410391, "Study on frame structure and timing aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[114]
R1-2410480, "Frame structure and timing aspects", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[115]
R1-2410516, "Frame structure and timing aspects", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[116]
R1-2410578, "Discussion on Frame structure and timing aspects", CEWiT, RAN1#119, Orlando, USA, November 2024.
[117]
R1-2410647, "Discussion on frame structure and timing aspects for Ambient IoT", China Telecom, RAN1#119, Orlando, USA, November 2024.
[118]
R1-2407612, "Discussion on D2R and R2D Channel/Signal Aspects for Ambient IoT", FUTUREWEI, RAN1#118bis, Hefei, China, October 2024.
[119]
R1-2407671, "Physical channels and signals for Ambient IoT", Huawei, HiSilicon, RAN1#118bis, Hefei, China, October 2024.
[120]
R1-2407864, "Discussion on Downlink and uplink channel/signal aspects", vivo, RAN1#118bis, Hefei, China, October 2024.
[121]
R1-2408050, "DL and UL Physical Channels/signals design in support of Ambient IoT devices", CATT, RAN1#118bis, Hefei, China, October 2024.
[122]
R1-2408069, "Discussion on channel and signal for Ambient IoT", ZTE Corporation, Sanechips, RAN1#118bis, Hefei, China, October 2024.
[123]
R1-2408149, "Discussion on downlink and uplink channel/signal aspects for A-IoT", OPPO, RAN1#118bis, Hefei, China, October 2024.
[124]
R1-2408532, "Considerations on Intermediate UE in A-IoT", Continental Automotive, RAN1#118bis, Hefei, China, October 2024.
[125]
R1-2408703, "Downlink and uplink channel/signal aspects", MediaTek Inc., RAN1#118bis, Hefei, China, October 2024.
[126]
R1-2408853, "Downlink and uplink channel/signal aspects", Qualcomm Incorporated, RAN1#118bis, Hefei, China, October 2024.
[127]
R1-2408932, "Discussion on Downlink and Uplink channel/signal aspects", CEWiT, RAN1#118bis, Hefei, China, October 2024.
[128]
R1-2408943, "Discussion on Downlink and Uplink channel signal aspects for AIoT", IIT Kanpur, Indian Institute of Tech (M), RAN1#118bis, Hefei, China, October 2024.
[129]
R1-2409023, "Downlink and uplink channel/signal aspects for Ambient IoT", Ericsson, RAN1#118bis, Hefei, China, October 2024.
[130]
R1-2409360, "Discussion on downlink and uplink channel/signal aspects for Ambient IoT", TCL, RAN1#119, Orlando, USA, November 2024.
[131]
R1-2409366, "R2D and D2R channel/signal aspects for Ambient IoT", Nokia, RAN1#119, Orlando, USA, November 2024.
[132]
R1-2409420, "Physical channels and signals for Ambient IoT", Huawei, HiSilicon, CBN, China Broadnet, RAN1#119, Orlando, USA, November 2024.
[133]
R1-2409515, "Discussion on downlink and uplink channel/signal aspects", CMCC, RAN1#119, Orlando, USA, November 2024.
[134]
R1-2409554, "Discussion on channel and signal for Ambient IoT", ZTE Corporation, Sanechips, RAN1#119, Orlando, USA, November 2024.
[135]
R1-2409600, "Considerations for downlink and uplink channel/signal aspect", Samsung, RAN1#119, Orlando, USA, November 2024.
[136]
R1-2409639, "Discussion on downlink and uplink channel/signal aspects for Ambient IoT", Spreadtrum, UNISOC, RAN1#119, Orlando, USA, November 2024.
[137]
R1-2409684, "Discussion on Downlink and uplink channel/signal aspects", vivo, RAN1#119, Orlando, USA, November 2024.
[138]
R1-2409803, "On remaining details of physical channels/signals for AIoT", Apple, RAN1#119, Orlando, USA, November 2024.
[139]
R1-2409899, "Discussion on downlink and uplink channel and signal aspects for Ambient IoT", Xiaomi, RAN1#119, Orlando, USA, November 2024.
[140]
R1-2409944, "DL and UL Physical Channels/signals design in support of Ambient IoT devices", CATT, RAN1#119, Orlando, USA, November 2024.
[141]
R1-2410028, "D2R and R2D Channel/Signal Aspects for Ambient IoT", FUTUREWEI, RAN1#119, Orlando, USA, November 2024.
[142]
R1-2410061, "Discussion on downlink and uplink channel/signal aspects", Fujitsu, RAN1#119, Orlando, USA, November 2024.
[143]
R1-2410094, "Discussion on downlink and uplink channel/signal aspects for A-IoT", OPPO, RAN1#119, Orlando, USA, November 2024.
[144]
R1-2410127, "Downlink and uplink channel/signal aspects for Ambient IoT", Ericsson, RAN1#119, Orlando, USA, November 2024.
[145]
R1-2410269, "Discussion on downlink and uplink channel/signal aspects for A-IoT", ETRI, RAN1#119, Orlando, USA, November 2024.
[146]
R1-2410289, "Downlink and uplink channel/signal aspects for Ambient IoT", LG Electronics, RAN1#119, Orlando, USA, November 2024.
[147]
R1-2410392, "Study on downlink and uplink channel/signal aspects for Ambient IoT", NTT DOCOMO, INC., RAN1#119, Orlando, USA, November 2024.
[148]
R1-2410481, "Downlink and uplink channel/signal aspects", Qualcomm Incorporated, RAN1#119, Orlando, USA, November 2024.
[149]
R1-2410517, "Downlink and uplink channel/signal aspects", MediaTek Inc., RAN1#119, Orlando, USA, November 2024.
[150]
R1-2410579, "Discussion on Downlink and Uplink channel/signal aspects", CEWiT, RAN1#119, Orlando, USA, November 2024.
[151]
TR 23.700-13: "Study on Architecture support of Ambient power-enabled Internet of Things".
→ to date, still a draft
[152]
TR 33.713: "Study on security aspects of Ambient Internet of Things (AIoT) services in 5G".
→ to date, still a draft
[153]
TS 38.300: "NR and NG-RAN Overall description; Stage-2".
[154]
TS 22.369: "Service requirements for Ambient power-enabled IoT".
[155]
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Up

3  Definitions of terms, symbols and abbreviationsp. 20

3.1  Termsp. 20

For the purposes of the present document, the terms given in TR 21.905 and the following apply. A term defined in the present document takes precedence over the definition of the same term, if any, in TR 21.905.
For the purposes of the study, this TR uses the following terms:
Device 1:
~1 μW peak power consumption, has energy storage, initial sampling frequency offset (SFO) up to 10X ppm, neither R2D nor D2R amplification in the device. The device's D2R transmission is backscattered on a carrier wave provided externally.
Device 2a:
≤ a few hundred μW peak power consumption, has energy storage, initial sampling frequency offset (SFO) up to 10X ppm, both R2D and/or D2R amplification in the device. The device's D2R transmission is backscattered on a carrier wave provided externally.
Device 2b:
≤ a few hundred μW peak power consumption, has energy storage, initial sampling frequency offset (SFO) up to 10X ppm, both R2D and/or D2R amplification in the device. The device's D2R transmission is generated internally by the device.
D1T1:
Deployment scenario 1 with connectivity topology 1, according to TR 38.848.
D2T2:
Deployment scenario 2 with connectivity topology 2, according to TR 38.848.
Inventory:
The service provided by the network to discover and acquire the identifier of A-IoT device(s).
Command:
The service provided by the network to send the operation instruction to the A-IoT device (e.g. read, write, etc.).
Up

3.2  Symbolsp. 20

Void.

3.3  Abbreviationsp. 20

For the purposes of the present document, the abbreviations given in TR 21.905 and the following apply. An abbreviation defined in the present document takes precedence over the definition of the same abbreviation, if any, in TR 21.905.
1SB
Single sideband
2SB
Double sideband
A-IoT
Ambient IoT
A-IoT RAN
Ambient IoT Radio Access Network
BFSK
Binary frequency-shift keying
BPSK
Binary phase-shift keying
CAP
Clock-acquisition part (of R-TAS)
CFO
Carrier-frequency offset
CP
Cyclic prefix
CW
Carrier-wave
CW2D
Carrier-wave, or carrier-wave node, to device
D2R
Device to reader
DFT-s-OFDM
DFT-spread OFDM
DO-A
Device-originated autonomous
DO-DTT
Device-originated by device-terminated trigger
DT
Device-terminated
ED
Envelope detector
FAR
False alarm rate
FDR
False detection rate
FEC
Forward error-correction code
FR
Frequency Range
IF
Intermediate frequency
IoT
Internet of Things
LPWA
Low-power, wide-area
LTE-MTC
Long Term Evolution - Machine Type Communication
MCS
Modulation and coding scheme
MDR
Missed detection rate
MSK
Minimum-shift keying
NB-IoT
Narrowband IoT
OOK
On-off keying
PDRCH
Physical device-to-reader channel
PIE
Pulse interval encoding
PRDCH
Physical reader-to-device channel
R2D
Reader to device
RF
Radio frequency
RFID
Radio frequency identification
R-TAS
R2D timing acquisition signal
SER
Sample error rate
SFO
Sampling-frequency offset
ZIF
Zero IF
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