V4.1.0 (Wzip)
2001/03 38 p.
full Table of Contents for TR 25.834 Word version: 4.1.0
The present document describes the services provided by the physical layer and the layer 2/3 functionality for support of the 1.28 Mcps low chip rate option of UTRA TDD. Based on the protocol structure existing for UTRA TDD / FDD, it is identified which modifications will be required in order to enable the layer 1 characteristics and key features of the low chip rate option.