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TR 25.834
UTRA TDD low chip rate option;
Radio protocol aspects

3GPP‑Page  
V4.1.0 (Wzip)  2001/03  38 p.
Rapporteur:
Mr. Liu, YanHui

full Table of Contents for  TR 25.834  Word version:  4.1.0

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1  ScopeWord‑p. 6

The present document describes the services provided by the physical layer and the layer 2/3 functionality for support of the 1.28 Mcps low chip rate option of UTRA TDD. Based on the protocol structure existing for UTRA TDD / FDD, it is identified which modifications will be required in order to enable the layer 1 characteristics and key features of the low chip rate option.

2  ReferencesWord‑p. 6

3  Definitions and abbreviationsWord‑p. 6

3.1  DefinitionsWord‑p. 6

3.2  AbbreviationsWord‑p. 7

4  Background and IntroductionWord‑p. 8

5  Overview of Physical Layer of TDD Low Chip Rate OptionWord‑p. 8

5.1  Frame structureWord‑p. 8

5.2  Burst TypesWord‑p. 9

6  Services and Functions of the Physical Layer of 1.28 Mcps TDDWord‑p. 10

7  Model of physical layer of the UEWord‑p. 10

7.1  Uplink modelsWord‑p. 10

7.2  Downlink modelsWord‑p. 10

8  Formats and configurations for L1 data transferWord‑p. 10

9  UE Simultaneous Physical Channels combinationsWord‑p. 12

10  Measurements provided by the physical layerWord‑p. 15

11  Primitives of the physical layerWord‑p. 16

12  Layer 2 Services and FunctionsWord‑p. 17

13  Layer 3 - Uu Stratum Services and FunctionsWord‑p. 18

13.1  Uu Stratum servicesWord‑p. 18

13.2  RRC functionsWord‑p. 18

13.3  RRC Protocol AspectsWord‑p. 18

13.3.1  Discussion on Physical Channel Parameters for 1.28 Mcps TDDWord‑p. 18

13.3.2  Parameter description for 1.28Mcps TDDWord‑p. 19

13.3.3  Information elements for 1.28Mcps TDDWord‑p. 22

13.3.4  IE change example for 1.28Mcps TDDWord‑p. 28

14  Key Procedures of TDD Low Chip Rate OptionWord‑p. 29

15  Cell (Re)SelectionWord‑p. 33

16  Handover ProceduresWord‑p. 34

17  RecommendationsWord‑p. 37

$  Change historyWord‑p. 38


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